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Description
Heat Seal Connector interconnecting circuit is a film can be bent, performance and stability of the ease of use of new materials and conduct a pcb and lcd the best way of its unique nature of the electrical conductivity, and make it more convenient, fast and reliable connection for the computer and recorder, playstation and telephone, repeater, CD player, digital camera instruments, doc- the electron clock, car stereo, etc. conduction of electricity heat seal the paper was used to get fat ： the film for a pet motoki conducting
Construction:
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Polyester |
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Conductive lines |
Thermosetting resin carbon ink |
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Adhesive |
Carbon particles
Thermoplastic synthetic rubber adhesive |
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Insulation layer |
Printed themoplastic synthetic rubber |
HSC Assembly Way
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Bonding Pressure |
30～50KG/CM2 |
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Bonding Period |
5±2 Seconds |
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Bonding Temperature |
150±20℃ |
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Silicone Rubber Hardmess |
70～80 degree |
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Silicone Rubber Thickness |
0.25～0.5MM |
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Scope of Rated
Temperature and
Humidity Test |
ITEM |
GIVEN CONDITIONS |
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Storage,High Temp. |
1,000hrs at 80℃±2 ℃ |
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Storage,Low temp. |
1,000 at -30℃±3℃ |
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Storage,High Temp. & High Humidity |
1,000hrs at 60 ℃ ± 2 ℃ and 90% RH 05% |
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Heat Cycle, High–Low Temp. at High Humidity |
12hrs at 60 ℃ ± 2 ℃,90% RH ±05%
thence to -30 ℃ ± 3℃ for 12hrs
10cycles of the above |
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Heat Cycle, High Temp. & Ambient–Low Temp. |
30min. At 80 ℃ ±2 ,at Ambient
Temp. for 5 Min.
Thence at -30 ℃ ± 3 for 30 min.
10cycles of the above
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Applied voltage & specimens
subjected to tests |
Voltage Endurance, at High Frequency |
Application of 50V,400KHz for 1 min |
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Materials subjected to be heat sealed |
Glass, 1 mm thick, coated with Indium
Oxide Polyimid, 25 microns thick, Au.
Plated over copper clad. |
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Pitch |
1.0MM |
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Heat Sealing Conditions
Temp. at sealing face
Duration of sealing
Pressure applied |
150℃
5 Seconds
35KG/CM2 |
HSC Test Condition
l Credibility:
l Thermal resistance : 80°C x 1000Hrs
l Cold resistance : -30°C x 1000Hrs
l Thermal Humidity resistance : 60°C oo 95%R-H. x 500Hrs
l Thermal Shock resistance : -30°C x 1 Hr <--> 80°C x 1 Hr . 250cycles
l Connecting Resistance : Digital multi meter (Cover the resistance of conductive Ag or Carbon lines)
l Adhesion : 90 degree peel strength at 25°C, pull speed : 50 mm/min.
l Insulation Resistance between Line :
l Between near conductive line [EX : Pitch : 0.5 (width/spacer = 1/1)] Measure resistance at 250Vdc between two lines
MEASURING METHODS
l Conductive resistance; between the ends of a trance/pattern*
l Insulation resistance between traces; between the traces/patterns voltage applied:50 v. dc
Physical Adhesion Strength; Exfoliation test at tensile speed 130mm/min
Measuring device employed:
Digital Multi-purpose Meter
High Resistance Meter
ITEMS |
DESCRIPTION |
GRAPHITE |
SILVER |
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Conductive Resistance
|
Ambient Environment |
70ohm/□ |
0.5ohm/sq |
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Rated Temp & Humidity |
90ohm/□ |
0.8ohm/sq |
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Insulation Resistance
(between traces)
|
Ambient Environment
Rated Temp. & Humidity |
More than 100M ohm ditto |
More than 100M ohm
Ditto |
|
Physical Adhesion
Strength
|
Ambient Environment
X-direction
Y-direction |
More than 500grm
More than 200grm |
More than 500grm more
than 200grm |
|
Rated Temp. Humidity
X-direction,
Y-direction, |
More than 400grm
More than 180grm |
More than400grm
More than 180grm |
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Appearance
|
Ambient Environment |
No abnormalities observed |
|
|
Rated Temp. & Humidity |
Ditto |
|
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High Frequency Endurance
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Conductive Resistance |
70ohm/□ |
0.08ohm/sq |
|
Insulation Resistance
(between traces) |
More than 100M ohm |
More than 100M ohm |
|
Appearance |
No abnormalities observed |
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Dimension and tolerance
|
Item |
Unit |
Standard |
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Size L x H |
mm |
100 x 210 |
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Dimension tolerance |
Length (L) |
mm |
±0.25 |
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Height (H) |
±0.25 (10 H 120), ±0.5 (120<H 200), ±1.0 (200<) |
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Width of conductor (Tc) |
mm |
0.25 |
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Pitch tolerance |
mm |
±0.05 (P<1.0)±0.10 (P 1.0) |
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Accumulative pitch (TP) |
mm |
±0.1 (TP 100) |
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Thickness of base film (T) |
µm |
25 |
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Pitch (P) |
mm |
0.25 |
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Thickness of cover film (option) |
µm |
12 or 25 |
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